TASMP300-DST

using the world’s most advanced mono silicone pressure sensor

technology and patent encapsulation technology.

Mono silicone pressure sensor locates on the top of the metal body

and stay away from the medium interface to realizes mechanical

isolation and thermal isolation. Glass sintering sensor wire

realizes high strength electrical insulation of metal base and

improves the capability of flexibility of electronic circuit and

transient voltage resistance protection.

All these original encapsulation technologies enable TADMP300 to

easily cope with extreme chemical occasion and mechanical load,

and own strong resistance to EMI, sufficient to respond to the

most rigorous industrial environment applications, which are the

genuine invisible instruments.